Introduction to Microsystem Packaging Technology

Nonfiction, Science & Nature, Technology, Electronics, Microelectronics
Cover of the book Introduction to Microsystem Packaging Technology by Yufeng Jin, Zhiping Wang, Jing Chen, Taylor and Francis
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Yufeng Jin, Zhiping Wang, Jing Chen ISBN: 9781351832977
Publisher: Taylor and Francis Publication: December 19, 2017
Imprint: CRC Press Language: English
Author: Yufeng Jin, Zhiping Wang, Jing Chen
ISBN: 9781351832977
Publisher: Taylor and Francis
Publication: December 19, 2017
Imprint: CRC Press
Language: English

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems.

Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge.

Elucidates the evolving world of  packaging technologies for manufacturing

The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection.

With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems.

Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge.

Elucidates the evolving world of  packaging technologies for manufacturing

The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection.

With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.

More books from Taylor and Francis

Cover of the book Getting it Right This Time by Yufeng Jin, Zhiping Wang, Jing Chen
Cover of the book Air Transport in the 21st Century by Yufeng Jin, Zhiping Wang, Jing Chen
Cover of the book Health Communication and Mass Media by Yufeng Jin, Zhiping Wang, Jing Chen
Cover of the book Potent Fictions by Yufeng Jin, Zhiping Wang, Jing Chen
Cover of the book Acing the LLB by Yufeng Jin, Zhiping Wang, Jing Chen
Cover of the book Skill Acquisition and Training by Yufeng Jin, Zhiping Wang, Jing Chen
Cover of the book Overseas Chinese in the People's Republic of China by Yufeng Jin, Zhiping Wang, Jing Chen
Cover of the book Food, Energy and Water Sustainability by Yufeng Jin, Zhiping Wang, Jing Chen
Cover of the book Military Industry and Regional Defense Policy by Yufeng Jin, Zhiping Wang, Jing Chen
Cover of the book Systemic Approaches to Training in Child Protection by Yufeng Jin, Zhiping Wang, Jing Chen
Cover of the book Averroes and His Philosophy by Yufeng Jin, Zhiping Wang, Jing Chen
Cover of the book The Psychological Birth of the Human Infant by Yufeng Jin, Zhiping Wang, Jing Chen
Cover of the book The Routledge International Handbook of Globalization Studies by Yufeng Jin, Zhiping Wang, Jing Chen
Cover of the book State Repression in Post-Disaster Societies by Yufeng Jin, Zhiping Wang, Jing Chen
Cover of the book Fairbridge: Empire and Child Migration by Yufeng Jin, Zhiping Wang, Jing Chen
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy