Zhiping Wang: 1 book

Book cover of Introduction to Microsystem Packaging Technology
by Yufeng Jin, Zhiping Wang, Jing Chen
Language: English
Release Date: December 19, 2017

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use...
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