3D IC Stacking Technology

Nonfiction, Science & Nature, Technology, Electronics, Circuits, Telecommunications
Cover of the book 3D IC Stacking Technology by Banqiu Wu, Sesh Ramaswami, Ajay Kumar, McGraw-Hill Education
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Banqiu Wu, Sesh Ramaswami, Ajay Kumar ISBN: 9780071741965
Publisher: McGraw-Hill Education Publication: October 14, 2011
Imprint: McGraw-Hill Education Language: English
Author: Banqiu Wu, Sesh Ramaswami, Ajay Kumar
ISBN: 9780071741965
Publisher: McGraw-Hill Education
Publication: October 14, 2011
Imprint: McGraw-Hill Education
Language: English

The latest advances in three-dimensional integrated circuit stacking technology

With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.

3D IC Stacking Technology covers:

  • High density through silicon stacking (TSS) technology
  • Practical design ecosystem for heterogeneous 3D IC products
  • Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack
  • Process integration for TSV manufacturing
  • High-aspect-ratio silicon etch for TSV
  • Dielectric deposition for TSV
  • Barrier and seed deposition
  • Copper electrodeposition for TSV
  • Chemical mechanical polishing for TSV applications
  • Temporary and permanent bonding
  • Assembly and test aspects of TSV technology
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

The latest advances in three-dimensional integrated circuit stacking technology

With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.

3D IC Stacking Technology covers:

More books from McGraw-Hill Education

Cover of the book iPhone Geekery: 50 Insanely Cool Hacks and Mods for Your iPhone 4S by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book Engineering Problem-Solving 101: Time-Tested and Timeless Techniques by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book HTML, XHTML & CSS QuickSteps by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book The Social Entrepreneur's Handbook: How to Start, Build, and Run a Business That Improves the World by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book Great Jobs for Business Majors by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book Conducting The Home Visit In Child Protection by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book Making Human Capital Analytics Work: Measuring the ROI of Human Capital Processes and Outcomes by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book The Toyota Way to Success EBOOK BUNDLE by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book How to Succeed with Continuous Improvement: A Primer for Becoming the Best in the World by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book The Art of Shaping the Metropolis by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book The Technical Analysis Course, Fourth Edition: Learn How to Forecast and Time the Market by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book Building Outrigger Sailing Canoes by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book HOLD: How to Find, Buy, and Rent Houses for Wealth by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book Oracle Database 12c PL/SQL Advanced Programming Techniques by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Cover of the book Oil Spills and Gas Leaks: Environmental Response, Prevention and Cost Recovery by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy