Sesh Ramaswami: 1 book

Book cover of 3D IC Stacking Technology
by Banqiu Wu, Sesh Ramaswami, Ajay Kumar
Language: English
Release Date: October 14, 2011

The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative...
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