Wafer-Level Chip-Scale Packaging

Analog and Power Semiconductor Applications

Nonfiction, Science & Nature, Technology, Electronics, Circuits
Cover of the book Wafer-Level Chip-Scale Packaging by Shichun Qu, Yong Liu, Springer New York
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Shichun Qu, Yong Liu ISBN: 9781493915569
Publisher: Springer New York Publication: September 10, 2014
Imprint: Springer Language: English
Author: Shichun Qu, Yong Liu
ISBN: 9781493915569
Publisher: Springer New York
Publication: September 10, 2014
Imprint: Springer
Language: English

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.

More books from Springer New York

Cover of the book Endocrine Pathology by Shichun Qu, Yong Liu
Cover of the book Innovations in HIV Prevention Research and Practice through Community Engagement by Shichun Qu, Yong Liu
Cover of the book The Long-Term Retention of Knowledge and Skills by Shichun Qu, Yong Liu
Cover of the book African American Girls by Shichun Qu, Yong Liu
Cover of the book Bounded Noises in Physics, Biology, and Engineering by Shichun Qu, Yong Liu
Cover of the book Classical Conditioning and Operant Conditioning by Shichun Qu, Yong Liu
Cover of the book Industry’s Voice in Health Policy by Shichun Qu, Yong Liu
Cover of the book Microglia in the Regenerating and Degenerating Central Nervous System by Shichun Qu, Yong Liu
Cover of the book Fundamentals of Space Business and Economics by Shichun Qu, Yong Liu
Cover of the book Thermodynamics of Crystalline States by Shichun Qu, Yong Liu
Cover of the book Attitudinal Judgment by Shichun Qu, Yong Liu
Cover of the book The Practice of Functional Analytic Psychotherapy by Shichun Qu, Yong Liu
Cover of the book Functional and Motility Disorders of the Gastrointestinal Tract by Shichun Qu, Yong Liu
Cover of the book Evidence-Based Interventions for Children with Challenging Behavior by Shichun Qu, Yong Liu
Cover of the book Food Safety = Behavior by Shichun Qu, Yong Liu
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy