Shichun Qu: 1 book
Wafer-Level Chip-Scale Packaging
Analog and Power Semiconductor Applications
Language: English
Release Date: September 10, 2014
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology...
