Yong Liu: 9 books

Book cover of Modeling and Simulation for Microelectronic Packaging Assembly
by Sheng Liu, Yong Liu
Language: English
Release Date: August 24, 2011

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design...
Book cover of 3D Cinematic Aesthetics and Storytelling
by Yong Liu
Language: English
Release Date: July 5, 2018

This book argues that 3D films are becoming more sophisticated in utilising stereoscopic effects for storytelling purposes. Since *Avatar *(2009), we have seen a 3D revival marked by its integration with new digital technologies. With this book, the author goes beyond exploring 3D’s spectacular...
Book cover of Organizing Rural China — Rural China Organizing
by Jonathan Unger, Unn Målfrid H. Rolandsen, Christian Göbel
Language: English
Release Date: April 5, 2012

During the early 1980s China embarked on what can be seen as one of the world’s largest social experiments ever. Decollectivization meant much more than the reorganization of agricultural production into family based farming. It signalled significant changes to rural social relations, when privatization,...
Book cover of Power Electronic Packaging

Power Electronic Packaging

Design, Assembly Process, Reliability and Modeling

by Yong Liu
Language: English
Release Date: February 15, 2012

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design,...
Book cover of Wafer-Level Chip-Scale Packaging

Wafer-Level Chip-Scale Packaging

Analog and Power Semiconductor Applications

by Shichun Qu, Yong Liu
Language: English
Release Date: September 10, 2014

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology...
Book cover of High Order Large Eddy Simulation for Shock-Boundary Layer Interaction Control by a Micro-ramp Vortex Generator
by Chaoqun Liu, Chaoqun Liu, Chaoqun Liu
Language: English
Release Date: December 8, 2017

This volume presents an implicitly implemented large eddy simulation (ILES) by using the fifth order bandwidth-optimized WENO scheme. The chosen method is applied to make comprehensive studies on ramp flows with and without control at Mach 2.5 and Re=5760. Flow control in the form of microramp vortex...
Book cover of Thirty Years of China - U.S. Relations

Thirty Years of China - U.S. Relations

Analytical Approaches and Contemporary Issues

by Youri Devuyst, Keith Eric Flick, Dennis Hickey
Language: English
Release Date: August 4, 2010

The year 2009 marks the 30th anniversary of normalization of Sino-U.S. relations. Over the past 30 years, the bilateral relations have developed by twists and turns. It is not until recent years that some stability and forward-looking exchanges have returned to the central stage, albeit tension, grievances,...
Book cover of Interconnected Power Systems

Interconnected Power Systems

Wide-Area Dynamic Monitoring and Control Applications

by Yong Li, Dechang Yang, Fang Liu
Language: English
Release Date: December 23, 2015

This book reports on the latest findings in the application of the wide area measurement systems (WAMS) in the analysis and control of power systems. The book collects new research ideas and achievements including a delay-dependent robust design method, a wide area robust coordination strategy, a...
Book cover of Location Privacy in Mobile Applications
by Bo Liu, Wanlei Zhou, Tianqing Zhu
Language: English
Release Date: August 30, 2018

This book provides a comprehensive study of the state of the art in location privacy for mobile applications. It presents an integrated five-part framework for location privacy research, which includes the analysis of location privacy definitions, attacks and adversaries, location privacy protection...
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