Adhesives Technology for Electronic Applications

Materials, Processing, Reliability

Nonfiction, Science & Nature, Science, Chemistry, Technical & Industrial, Technology, Material Science
Cover of the book Adhesives Technology for Electronic Applications by James J. Licari, Dale W. Swanson, Elsevier Science
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Author: James J. Licari, Dale W. Swanson ISBN: 9780815516002
Publisher: Elsevier Science Publication: August 30, 2005
Imprint: William Andrew Language: English
Author: James J. Licari, Dale W. Swanson
ISBN: 9780815516002
Publisher: Elsevier Science
Publication: August 30, 2005
Imprint: William Andrew
Language: English

This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references.

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This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references.

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