James J Licari: 5 books

Book cover of Adhesives Technology for Electronic Applications

Adhesives Technology for Electronic Applications

Materials, Processing, Reliability

by James J. Licari, Dale W. Swanson
Language: English
Release Date: June 24, 2011

Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps...
Book cover of Handbook of Polymer Coatings for Electronics

Handbook of Polymer Coatings for Electronics

Chemistry, Technology and Applications

by James J. Licari, Laura A. Hughes
Language: English
Release Date: December 31, 1990

This completely revised edition remains the only comprehensive treatise on polymer coatings for electronics. Since the original edition, the applications of coatings for the environmental protection of electronic systems have greatly increased, largely driven by the competitive need to reduce costs,...
Book cover of Adhesives Technology for Electronic Applications

Adhesives Technology for Electronic Applications

Materials, Processing, Reliability

by James J. Licari, Dale W. Swanson
Language: English
Release Date: August 30, 2005

This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments...
Book cover of Hybrid Microcircuit Technology Handbook

Hybrid Microcircuit Technology Handbook

Materials, Processes, Design, Testing and Production

by James J. Licari, Leonard R Enlow
Language: English
Release Date: December 31, 1998

The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning,...
Book cover of Encapsulation Technologies for Electronic Applications
by Haleh Ardebili, Jiawei Zhang, Michael Pecht
Language: English
Release Date: October 23, 2018

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D...
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