Dale W Swanson: 2 books

Book cover of Adhesives Technology for Electronic Applications

Adhesives Technology for Electronic Applications

Materials, Processing, Reliability

by James J. Licari, Dale W. Swanson
Language: English
Release Date: June 24, 2011

Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps...
Book cover of Adhesives Technology for Electronic Applications

Adhesives Technology for Electronic Applications

Materials, Processing, Reliability

by James J. Licari, Dale W. Swanson
Language: English
Release Date: August 30, 2005

This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments...
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy