Constrained Deformation of Materials

Devices, Heterogeneous Structures and Thermo-Mechanical Modeling

Nonfiction, Science & Nature, Technology, Engineering, Industrial, Mechanical
Cover of the book Constrained Deformation of Materials by Y.-L. Shen, Springer US
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Y.-L. Shen ISBN: 9781441963123
Publisher: Springer US Publication: August 9, 2010
Imprint: Springer Language: English
Author: Y.-L. Shen
ISBN: 9781441963123
Publisher: Springer US
Publication: August 9, 2010
Imprint: Springer
Language: English

"Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-Mechanical Modeling" is an in-depth look at the mechanical analyses and modeling of advanced small-scale structures and heterogeneous material systems. Mechanical deformations in thin films and miniaturized materials, commonly found in microelectronic devices and packages, MEMS, nanostructures and composite and multi-phase materials, are heavily influenced by the external or internal physical confinement. A continuum mechanics-based approach is used, together with discussions on micro-mechanisms, to treat the subject in a systematic manner under the unified theme. Readers will find valuable information on the proper application of thermo-mechanics in numerical modeling as well as in the interpretation and prediction of physical material behavior, along with many case studies. Additionally, particular attention is paid to practical engineering relevance. Thus real-life reliability issues are discussed in detail to serve the needs of researchers and engineers alike.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

"Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-Mechanical Modeling" is an in-depth look at the mechanical analyses and modeling of advanced small-scale structures and heterogeneous material systems. Mechanical deformations in thin films and miniaturized materials, commonly found in microelectronic devices and packages, MEMS, nanostructures and composite and multi-phase materials, are heavily influenced by the external or internal physical confinement. A continuum mechanics-based approach is used, together with discussions on micro-mechanisms, to treat the subject in a systematic manner under the unified theme. Readers will find valuable information on the proper application of thermo-mechanics in numerical modeling as well as in the interpretation and prediction of physical material behavior, along with many case studies. Additionally, particular attention is paid to practical engineering relevance. Thus real-life reliability issues are discussed in detail to serve the needs of researchers and engineers alike.

More books from Springer US

Cover of the book Nanopores by Y.-L. Shen
Cover of the book Air Pollution Modeling and Its Application XI by Y.-L. Shen
Cover of the book Core Concepts in Renal Transplantation by Y.-L. Shen
Cover of the book Risk-Based Environmental Decisions by Y.-L. Shen
Cover of the book Gender Dysphoria by Y.-L. Shen
Cover of the book Identification of Transcribed Sequences by Y.-L. Shen
Cover of the book Virtual Testing and Predictive Modeling by Y.-L. Shen
Cover of the book Neural Engineering by Y.-L. Shen
Cover of the book Thoracic Trauma and Critical Care by Y.-L. Shen
Cover of the book The Southwest Economy in the 1990s: A Different Decade by Y.-L. Shen
Cover of the book The Auditory Cortex by Y.-L. Shen
Cover of the book Exercise Testing by Y.-L. Shen
Cover of the book Genetic Counseling for Adult Neurogenetic Disease by Y.-L. Shen
Cover of the book The Pulmonary and Bronchial Circulations in Congenital Heart Disease by Y.-L. Shen
Cover of the book Teaching and Measuring Cognitive Readiness by Y.-L. Shen
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy