Michael Pecht: 12 books

Book cover of Encapsulation Technologies for Electronic Applications
by Haleh Ardebili, Michael Pecht
Language: English
Release Date: July 22, 2009

Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination,...
Book cover of Electronic Packaging Materials and Their Properties
by Michael Pecht, Rakish Agarwal, F. Patrick McCluskey
Language: English
Release Date: December 19, 2017

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from...
Book cover of Reliability Engineering
by Kailash C. Kapur, Michael Pecht
Language: English
Release Date: March 21, 2014

An Integrated Approach to Product Development Reliability Engineering presents an integrated approach to the design, engineering, and management of reliability activities throughout the life cycle of a product, including concept, research and development, design, manufacturing, assembly, sales,...
Book cover of Encapsulation Technologies for Electronic Applications
by Haleh Ardebili, Jiawei Zhang, Michael Pecht
Language: English
Release Date: October 23, 2018

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D...
Book cover of Guidebook for Managing Silicon Chip Reliability
by Michael Pecht, Riko Radojcic, Gopal Rao
Language: English
Release Date: November 22, 2017

Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with...
Book cover of Handbook of Electronic Package Design
by Michael Pecht
Language: English
Release Date: October 24, 2018

Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Book cover of The Chinese Electronics Industry
by Michael Pecht, Chung-Shing Lee, Wang Yong Wen
Language: English
Release Date: December 19, 2018

The Chinese Electronics Industry documents the technologies, capabilities, and infrastructure that has made China a major player in the Asian electronics industry. This book covers the major segments of China's electronics industry, including semiconductors, packaging, printed circuit boards, computer...
Book cover of The Japanese Electronics Industry
by Wataru Nakayama, WIlliam Boulton, Michael Pecht
Language: English
Release Date: January 15, 2019

The explosive growth of the Japanese electronics industry continues to be driven by a combination of market forces and the unique characteristics of the Japanese social organization and people. As an industrial phenomenon, the Japanese electronics industry receives considerable attention from researchers...
Book cover of Optimum Cooling of Data Centers

Optimum Cooling of Data Centers

Application of Risk Assessment and Mitigation Techniques

by Jun Dai, Michael M. Ohadi, Diganta Das
Language: English
Release Date: November 20, 2013

This book describes the use of free air cooling to improve the efficiency of, and cooling of, equipment for use in telecom infrastructures. Discussed at length is the cooling of communication installation rooms such as data centers or base stations, and this is intended as a valuable tool for the...
Book cover of Strategies to the Prediction, Mitigation and Management of Product Obsolescence
by Bjoern Bartels, Ulrich Ermel, Peter Sandborn
Language: English
Release Date: April 4, 2012

Supply chains for electronic products are primarily driven by consumer electronics. Every year new mobile phones, computers and gaming consoles are introduced, driving the continued applicability of Moore's law. The semiconductor manufacturing industry is highly dynamic and releases new, better and...
Book cover of Risk-Based Engineering

Risk-Based Engineering

An Integrated Approach to Complex Systems—Special Reference to Nuclear Plants

by Prabhakar V. Varde, Michael G. Pecht
Language: English
Release Date: April 19, 2018

The book comprehensively covers the various aspects of risk modeling and analysis in technological contexts. It pursues a systems approach to modeling risk and reliability concerns in engineering, and covers the key concepts of risk analysis and mathematical tools used to assess and account for risk...
Book cover of Copper Wire Bonding
by Preeti S Chauhan, Anupam Choubey, ZhaoWei Zhong
Language: English
Release Date: September 20, 2013

This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks.  Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high...
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