John Hock Lye Pang: 1 book

Book cover of Lead Free Solder

Lead Free Solder

Mechanics and Reliability

by John Hock Lye Pang
Language: English
Release Date: October 15, 2011

Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free...
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