Jennie Hwang: 1 book
Solder Paste in Electronics Packaging
Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
Language: English
Release Date: December 6, 2012
One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other...
