Feifei He: 1 book

Book cover of Electromigration Modeling at Circuit Layout Level
by Feifei He, Cher Ming Tan
Language: English
Release Date: March 16, 2013

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has...
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