F Patrick Mccluskey: 2 books

Book cover of Electronic Packaging Materials and Their Properties
by Michael Pecht, Rakish Agarwal, F. Patrick McCluskey
Language: English
Release Date: December 19, 2017

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from...
Book cover of High Temperature Electronics
by F. Patrick McCluskey, Thomas Podlesak, Richard Grzybowski
Language: English
Release Date: May 4, 2018

The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200...
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