Advances in 3D Integrated Circuits and Systems

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.

Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.

Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

Contents:

• Introduction

• Device Modeling:

  • Fabrication
  • Device Model

• Physical Design:

  • Macromodel
  • TSV Allocation
  • Testing

• Thermal Management:

  • Power and Thermal System Model
  • Microfluidic Based Cooling

• I/O Management:

  • Power I/O Management
  • Signal I/O Management
  • Sensor
  • I/O
  • Microprocessor
  • Non-volatile Memory

Readership: Advanced undergraduates, graduate students, researchers and professionals dealing with 3D Integrated Circuits and Systems.
Key Features:

• This book that presents a comprehensive overview on the subject of 3D integrated circuits focusing on the design of circuits and systems
• This book covers multiple topics about 3D integrated circuits, starting from fabrication, to modeling; then moving to system level power, thermal and I/O management techniques; and finally, the design examples of emerging technologies