Advanced Polyimide Materials
Synthesis, Characterization, and Applications
Nonfiction, Science & Nature, Technology, Textiles & Polymers, Material Science
| Author: | ISBN: | 9780128126417 | |
| Publisher: | Elsevier Science | Publication: | April 20, 2018 |
| Imprint: | Elsevier | Language: | English |
| Author: | |
| ISBN: | 9780128126417 |
| Publisher: | Elsevier Science |
| Publication: | April 20, 2018 |
| Imprint: | Elsevier |
| Language: | English |
Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research.
The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation.
- Reviews the latest research, development and future prospective of polyimides
- Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers
- Presents a highly organized work that is composed of different sections that are easily compared
Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research.
The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation.
- Reviews the latest research, development and future prospective of polyimides
- Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers
- Presents a highly organized work that is composed of different sections that are easily compared
