| Author: | K. L. Mittal, Tanweer Ahsan | ISBN: | 9781118831342 |
| Publisher: | Wiley | Publication: | August 25, 2014 |
| Imprint: | Wiley-Scrivener | Language: | English |
| Author: | K. L. Mittal, Tanweer Ahsan |
| ISBN: | 9781118831342 |
| Publisher: | Wiley |
| Publication: | August 25, 2014 |
| Imprint: | Wiley-Scrivener |
| Language: | English |
This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include;
- Various theories or mechanisms of adhesion
- Surface (physical or chemical) characterization of materials as it pertains to adhesion
- Surface cleaning as it pertains to adhesion
- Ways to improve adhesion
- Unraveling of interfacial interactions using an array of pertinent techniques
- Characterization of interfaces / interphases
- Polymer-polymer adhesion
- Metal-polymer adhesion (metallized polymers)
- Polymer adhesion to various substrates
- Adhesion of thin films
- Adhesion of underfills
- Adhesion of molding compounds
- Adhesion of different dielectric materials
- Delamination and reliability issues in packaged devices
- Interface mechanics and crack propagation
- Adhesion measurement of thin films and coatings
This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include;
- Various theories or mechanisms of adhesion
- Surface (physical or chemical) characterization of materials as it pertains to adhesion
- Surface cleaning as it pertains to adhesion
- Ways to improve adhesion
- Unraveling of interfacial interactions using an array of pertinent techniques
- Characterization of interfaces / interphases
- Polymer-polymer adhesion
- Metal-polymer adhesion (metallized polymers)
- Polymer adhesion to various substrates
- Adhesion of thin films
- Adhesion of underfills
- Adhesion of molding compounds
- Adhesion of different dielectric materials
- Delamination and reliability issues in packaged devices
- Interface mechanics and crack propagation
- Adhesion measurement of thin films and coatings
