3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
Nonfiction, Science & Nature, Technology, Engineering
| Author: | Lih-Tyng Hwang, Tzyy-Sheng Jason Horng | ISBN: | 9781119289661 |
| Publisher: | Wiley | Publication: | March 29, 2018 |
| Imprint: | Wiley-IEEE Press | Language: | English |
| Author: | Lih-Tyng Hwang, Tzyy-Sheng Jason Horng |
| ISBN: | 9781119289661 |
| Publisher: | Wiley |
| Publication: | March 29, 2018 |
| Imprint: | Wiley-IEEE Press |
| Language: | English |
An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments
- Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility
- Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab
- Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
- Provides chapter-wise review questions and powerpoint slides as teaching tools
An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments
- Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility
- Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab
- Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
- Provides chapter-wise review questions and powerpoint slides as teaching tools
