The Electronic Packaging Handbook

Nonfiction, Science & Nature, Technology, Electronics
Cover of the book The Electronic Packaging Handbook by , CRC Press
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: ISBN: 9781351835541
Publisher: CRC Press Publication: December 19, 2017
Imprint: CRC Press Language: English
Author:
ISBN: 9781351835541
Publisher: CRC Press
Publication: December 19, 2017
Imprint: CRC Press
Language: English

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary.

The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems.

Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety.

Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary.

The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems.

Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety.

Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

More books from CRC Press

Cover of the book Multiresidue Methods for the Analysis of Pesticide Residues in Food by
Cover of the book Non-Conservative Systems by
Cover of the book Leading and Managing Innovation by
Cover of the book Recent Advancements in Software Reliability Assurance by
Cover of the book Climate Change and Terrestrial Carbon Sequestration in Central Asia by
Cover of the book Stay Cool by
Cover of the book Contemporary Phytomedicines by
Cover of the book Nanopatterning and Nanoscale Devices for Biological Applications by
Cover of the book Bayesian Designs for Phase I-II Clinical Trials by
Cover of the book Dosimetry in Bioelectromagnetics by
Cover of the book The Human Factors of Fratricide by
Cover of the book Experimental Pulse NMR by
Cover of the book Rat Hybridomas and Rat Monoclonal Antibodies (1990) by
Cover of the book An Introduction to the Science of Cosmology by
Cover of the book Sequential Models of Mathematical Physics by
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy