Modeling and Application of Flexible Electronics Packaging

Nonfiction, Science & Nature, Technology, Material Science, Electronics
Cover of the book Modeling and Application of Flexible Electronics Packaging by YongAn Huang, Zhouping Yin, Xiaodong Wan, Springer Singapore
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Author: YongAn Huang, Zhouping Yin, Xiaodong Wan ISBN: 9789811336270
Publisher: Springer Singapore Publication: April 23, 2019
Imprint: Springer Language: English
Author: YongAn Huang, Zhouping Yin, Xiaodong Wan
ISBN: 9789811336270
Publisher: Springer Singapore
Publication: April 23, 2019
Imprint: Springer
Language: English

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.

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This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.

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