VLSI-SoC: At the Crossroads of Emerging Trends
21st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2013, Istanbul, Turkey, October 6-9, 2013, Revised Selected Papers
Nonfiction, Computers, Application Software, CAD/CAM, Computer Hardware, Input-Output Equipment, General Computing
| Author: | ISBN: | 9783319237992 | |
| Publisher: | Springer International Publishing | Publication: | September 25, 2015 |
| Imprint: | Springer | Language: | English |
| Author: | |
| ISBN: | 9783319237992 |
| Publisher: | Springer International Publishing |
| Publication: | September 25, 2015 |
| Imprint: | Springer |
| Language: | English |
This book contains extended and revised versions of the best papers presented at the 21st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2013, held in Istanbul, Turkey, in October 2013. The 11 papers included in the book were carefully reviewed and selected from the 48 full papers presented at the conference. An extended version of a previously unpublished high-quality paper from VLSI-SoC 2012 is also included. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of these systems.
This book contains extended and revised versions of the best papers presented at the 21st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2013, held in Istanbul, Turkey, in October 2013. The 11 papers included in the book were carefully reviewed and selected from the 48 full papers presented at the conference. An extended version of a previously unpublished high-quality paper from VLSI-SoC 2012 is also included. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of these systems.
