Through-Silicon Vias for 3D Integration

Nonfiction, Science & Nature, Technology, Nanotechnology, Electronics, Circuits, Telecommunications
Cover of the book Through-Silicon Vias for 3D Integration by John H. Lau, McGraw-Hill Education
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: John H. Lau ISBN: 9780071785150
Publisher: McGraw-Hill Education Publication: August 5, 2012
Imprint: McGraw-Hill Education Language: English
Author: John H. Lau
ISBN: 9780071785150
Publisher: McGraw-Hill Education
Publication: August 5, 2012
Imprint: McGraw-Hill Education
Language: English

A comprehensive guide to TSV and other enabling technologies for 3D integration

Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed.

This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems.

Coverage includes:

  • Nanotechnology and 3D integration for the semiconductor industry
  • TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing
  • TSVs: mechanical, thermal, and electrical behaviors
  • Thin-wafer strength measurement
  • Wafer thinning and thin-wafer handling
  • Microbumping, assembly, and reliability
  • Microbump electromigration
  • Transient liquid-phase bonding: C2C, C2W, and W2W
  • 2.5D IC integration with interposers
  • 3D IC integration with interposers
  • Thermal management of 3D IC integration
  • 3D IC packaging
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

A comprehensive guide to TSV and other enabling technologies for 3D integration

Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed.

This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems.

Coverage includes:

More books from McGraw-Hill Education

Cover of the book Better Reading English: Improve Your Understanding of Written English by John H. Lau
Cover of the book Deja Review Surgery, 2nd Edition by John H. Lau
Cover of the book The VAR Implementation Handbook, Chapter 18 - Risk-Managing the Uncertainty in VaR Model Parameters by John H. Lau
Cover of the book 5 Steps to a 5: 500 AP Microeconomics Questions to Know by Test Day, Second Edition by John H. Lau
Cover of the book Math Word Problems Demystified 2/E by John H. Lau
Cover of the book Fluid Mechanics DeMYSTiFied by John H. Lau
Cover of the book Official GRE Quantitative Reasoning Practice Questions by John H. Lau
Cover of the book Solar Power for Your Home by John H. Lau
Cover of the book Canoe and Kayak Building the Light and Easy Way by John H. Lau
Cover of the book Stories from Mexico / Historias de México, Premium Third Edition by John H. Lau
Cover of the book Catamarans by John H. Lau
Cover of the book Respiratory: An Integrated Approach to Disease by John H. Lau
Cover of the book Toyota Supply Chain Management: A Strategic Approach to Toyota's Renowned System by John H. Lau
Cover of the book Schaum's Outline of Optics by John H. Lau
Cover of the book Diesel Engine Care and Repair by John H. Lau
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy