Author: | Chakravarti V. Madhusudana | ISBN: | 9783319012766 |
Publisher: | Springer International Publishing | Publication: | September 24, 2013 |
Imprint: | Springer | Language: | English |
Author: | Chakravarti V. Madhusudana |
ISBN: | 9783319012766 |
Publisher: | Springer International Publishing |
Publication: | September 24, 2013 |
Imprint: | Springer |
Language: | English |
The work covers both theoretical and practical aspects of thermal contact conductance. The theoretical discussion focuses on heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data that can be used in designing heat-transfer equipment for a variety of joints, including special geometries and configurations. All of the material has been updated to reflect the latest advances in the field.
The work covers both theoretical and practical aspects of thermal contact conductance. The theoretical discussion focuses on heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data that can be used in designing heat-transfer equipment for a variety of joints, including special geometries and configurations. All of the material has been updated to reflect the latest advances in the field.