RF and Microwave Microelectronics Packaging II

Nonfiction, Science & Nature, Technology, Microwaves, Electronics
Cover of the book RF and Microwave Microelectronics Packaging II by , Springer International Publishing
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: ISBN: 9783319516974
Publisher: Springer International Publishing Publication: March 9, 2017
Imprint: Springer Language: English
Author:
ISBN: 9783319516974
Publisher: Springer International Publishing
Publication: March 9, 2017
Imprint: Springer
Language: English

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

More books from Springer International Publishing

Cover of the book Search for the Higgs Boson in the Vector Boson Fusion Channel at the ATLAS Detector by
Cover of the book Environment and Society by
Cover of the book Psychiatric Pharmaceuticals as Emerging Contaminants in Wastewater by
Cover of the book Advances in Information and Computer Security by
Cover of the book Innovative Issues in Intelligent Systems by
Cover of the book International Trade Policy and European Industry by
Cover of the book Michał Kalecki: An Intellectual Biography by
Cover of the book Design of Reinforced Concrete Silo Groups by
Cover of the book Mobility, Migration and Transport by
Cover of the book Radio Monitoring by
Cover of the book The Politics of Trauma and Memory Activism by
Cover of the book E-Learning in the Workplace by
Cover of the book Information Systems Architecture and Technology: Proceedings of 38th International Conference on Information Systems Architecture and Technology – ISAT 2017 by
Cover of the book Biofilm-based Healthcare-associated Infections by
Cover of the book Non-equilibrium Statistical Physics with Application to Disordered Systems by
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy