Residual Stresses and Nanoindentation Testing of Films and Coatings

Nonfiction, Science & Nature, Technology, Material Science, Science, Physics, Mechanics
Cover of the book Residual Stresses and Nanoindentation Testing of Films and Coatings by Haidou Wang, Lina Zhu, Binshi Xu, Springer Singapore
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Haidou Wang, Lina Zhu, Binshi Xu ISBN: 9789811078415
Publisher: Springer Singapore Publication: March 12, 2018
Imprint: Springer Language: English
Author: Haidou Wang, Lina Zhu, Binshi Xu
ISBN: 9789811078415
Publisher: Springer Singapore
Publication: March 12, 2018
Imprint: Springer
Language: English

This book covers the basic principles and application of nanoindentation technology to determine residual stresses in films and coatings. It briefly introduces various detection technologies for measuring residual stresses, while mainly focusing on nanoindentation. Subsequently, nanoindentation is used to determine residual stresses in different types of films and coatings, and to describe them in detail. 

This book is intended for specialists, engineers and graduate students in mechanical design, manufacturing, maintenance and remanufacturing, and as a guide to the practice of production with social and economic benefits.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

This book covers the basic principles and application of nanoindentation technology to determine residual stresses in films and coatings. It briefly introduces various detection technologies for measuring residual stresses, while mainly focusing on nanoindentation. Subsequently, nanoindentation is used to determine residual stresses in different types of films and coatings, and to describe them in detail. 

This book is intended for specialists, engineers and graduate students in mechanical design, manufacturing, maintenance and remanufacturing, and as a guide to the practice of production with social and economic benefits.

More books from Springer Singapore

Cover of the book The Value of Wellness in the Workplace by Haidou Wang, Lina Zhu, Binshi Xu
Cover of the book Development under Dualism and Digital Divide in Twenty-First Century India by Haidou Wang, Lina Zhu, Binshi Xu
Cover of the book Soft Computing: Theories and Applications by Haidou Wang, Lina Zhu, Binshi Xu
Cover of the book Elements of Hilbert Spaces and Operator Theory by Haidou Wang, Lina Zhu, Binshi Xu
Cover of the book Creative Teaching by Haidou Wang, Lina Zhu, Binshi Xu
Cover of the book Foresight & Strategy in the Asia Pacific Region by Haidou Wang, Lina Zhu, Binshi Xu
Cover of the book Waste Management and Resource Efficiency by Haidou Wang, Lina Zhu, Binshi Xu
Cover of the book Optical And Microwave Technologies by Haidou Wang, Lina Zhu, Binshi Xu
Cover of the book Laugh out Loud: A User’s Guide to Workplace Humor by Haidou Wang, Lina Zhu, Binshi Xu
Cover of the book General Systemology by Haidou Wang, Lina Zhu, Binshi Xu
Cover of the book Oncoplastic surgery by Haidou Wang, Lina Zhu, Binshi Xu
Cover of the book Economic Analysis of Industrial Agglomeration by Haidou Wang, Lina Zhu, Binshi Xu
Cover of the book ISGW 2017: Compendium of Technical Papers by Haidou Wang, Lina Zhu, Binshi Xu
Cover of the book East-Asian Primary Science Curricula by Haidou Wang, Lina Zhu, Binshi Xu
Cover of the book Sustainable Operations in India by Haidou Wang, Lina Zhu, Binshi Xu
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy