Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Nonfiction, Science & Nature, Technology, Telecommunications
Cover of the book Reliability of RoHS-Compliant 2D and 3D IC Interconnects by John H. Lau, McGraw-Hill Education
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: John H. Lau ISBN: 9780071753807
Publisher: McGraw-Hill Education Publication: October 22, 2010
Imprint: McGraw-Hill Education Language: English
Author: John H. Lau
ISBN: 9780071753807
Publisher: McGraw-Hill Education
Publication: October 22, 2010
Imprint: McGraw-Hill Education
Language: English

Proven 2D and 3D IC lead-free interconnect reliability techniques

Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.

Covers reliability of:

  • 2D and 3D IC lead-free interconnects
  • CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints
  • Lead-free (SACX) solder joints
  • Low-temperature lead-free (SnBiAg) solder joints
  • Solder joints with voids, high strain rate, and high ramp rate
  • VCSEL and LED lead-free interconnects
  • 3D LED and 3D MEMS with TSVs
  • Chip-to-wafer (C2W) bonding and lead-free interconnects
  • Wafer-to-wafer (W2W) bonding and lead-free interconnects
  • 3D IC chip stacking with low-temperature bonding
  • TSV interposers and lead-free interconnects
  • Electromigration of lead-free microbumps for 3D IC integration
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Proven 2D and 3D IC lead-free interconnect reliability techniques

Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.

Covers reliability of:

More books from McGraw-Hill Education

Cover of the book Ubuntu Server Administration by John H. Lau
Cover of the book Real Leadership: 9 Simple Practices for Leading and Living with Purpose by John H. Lau
Cover of the book How to Do Everything with Your Scanner by John H. Lau
Cover of the book Health Promotion Theory by John H. Lau
Cover of the book The Art of Bank M&A: Buying, Selling, Merging, and Investing in Regulated Depository Institutions in the New Environment by John H. Lau
Cover of the book Killing Marketing: How Innovative Businesses Are Turning Marketing Cost Into Profit by John H. Lau
Cover of the book Leadership in the Era of Economic Uncertainty: Managing in a Downturn by John H. Lau
Cover of the book McGraw-Hill Education Firefighter Exam, 2nd Edition by John H. Lau
Cover of the book The Smart Growth Manual by John H. Lau
Cover of the book Social Marketology: Improve Your Social Media Processes and Get Customers to Stay Forever by John H. Lau
Cover of the book Case Files Cardiology by John H. Lau
Cover of the book The New Fat Flush Foods by John H. Lau
Cover of the book Your Perfect Presentation: Speak in Front of Any Audience Anytime Anywhere and Never Be Nervous Again by John H. Lau
Cover of the book Save Your Brain: The 5 Things You Must Do to Keep Your Mind Young and Sharp by John H. Lau
Cover of the book Schaum's Outline of Principles of Computer Science by John H. Lau
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy