Reliability and Failure of Electronic Materials and Devices

Nonfiction, Science & Nature, Technology, Material Science, Electronics
Cover of the book Reliability and Failure of Electronic Materials and Devices by Milton Ohring, Elsevier Science
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Milton Ohring ISBN: 9780080516073
Publisher: Elsevier Science Publication: June 12, 1998
Imprint: Academic Press Language: English
Author: Milton Ohring
ISBN: 9780080516073
Publisher: Elsevier Science
Publication: June 12, 1998
Imprint: Academic Press
Language: English

Suitable as a reference work for reliability professionals or as a text for advanced undergraduate or graduate students, this book introduces the reader to the widely dispersed reliability literature of microelectronic and electronic-optional devices. Reliability and Failure of Electronic Materials and Devices integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation, and the statistical handling of lifetime data. Electromigration, dielectric radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered. An underlying thread of the book concerns product defects--their relation to yield and reliability, the role they play in failure, and the way they are experimentally exposed.
The reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices, acquire skills in the mathematical handling of reliability data, and better appreciate future technology trends and the reliability issues they raise.

  • Discusses reliability and failure on both the chip and packaging levels
  • Handles the role of defects in yield and reliability
  • Includes a tutorial chapter on the mathematics of reliability
  • Focuses on electromigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage and the mechanical failure of packages, contacts, and solder joints
  • Considers defect detection methods and failure analysis techniques
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Suitable as a reference work for reliability professionals or as a text for advanced undergraduate or graduate students, this book introduces the reader to the widely dispersed reliability literature of microelectronic and electronic-optional devices. Reliability and Failure of Electronic Materials and Devices integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation, and the statistical handling of lifetime data. Electromigration, dielectric radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered. An underlying thread of the book concerns product defects--their relation to yield and reliability, the role they play in failure, and the way they are experimentally exposed.
The reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices, acquire skills in the mathematical handling of reliability data, and better appreciate future technology trends and the reliability issues they raise.

More books from Elsevier Science

Cover of the book Advanced Nanomaterials for Solar Cells and Light Emitting Diodes by Milton Ohring
Cover of the book Freeze-Drying of Pharmaceutical and Food Products by Milton Ohring
Cover of the book Nanoporous Materials III by Milton Ohring
Cover of the book Advances in Computers by Milton Ohring
Cover of the book Advances in Botanical Research by Milton Ohring
Cover of the book Mergers and Acquisitions Basics by Milton Ohring
Cover of the book Stress: Neuroendocrinology and Neurobiology by Milton Ohring
Cover of the book Topical Reviews in Neurosurgery by Milton Ohring
Cover of the book Rabies by Milton Ohring
Cover of the book Handbook of Financial Econometrics by Milton Ohring
Cover of the book Creativity in Engineering by Milton Ohring
Cover of the book New Directions for Academic Liaison Librarians by Milton Ohring
Cover of the book Past, Present and Future Challenges of Biosensors and Bioanalytical Tools in Analytical Chemistry: A Tribute to Professor Marco Mascini by Milton Ohring
Cover of the book Lockhart and Wiseman’s Crop Husbandry Including Grassland by Milton Ohring
Cover of the book The CRAF-E4 Family Engagement Model by Milton Ohring
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy