Nanopackaging: From Nanomaterials to the Atomic Scale

Proceedings of the 1st International Workshop on Nanopackaging, Grenoble 27-28 June 2013

Nonfiction, Science & Nature, Science, Other Sciences, Nanostructures, Technology, Nanotechnology
Cover of the book Nanopackaging: From Nanomaterials to the Atomic Scale by , Springer International Publishing
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: ISBN: 9783319211947
Publisher: Springer International Publishing Publication: August 6, 2015
Imprint: Springer Language: English
Author:
ISBN: 9783319211947
Publisher: Springer International Publishing
Publication: August 6, 2015
Imprint: Springer
Language: English

This book is a first attempt to merge two different communities: scientists and technologists. Therefore, it is not a general overview covering all the fields of nanopackaging, but is mainly focused on two topics. The first topic deals with atomic scale devices or circuit requirements, as well as related recent technological developments; for example, surface science engineering and atomic scale interconnects studies. The second main part of the book brings CNT nano-materials solutions for resolving interconnect or thermal management problems in microelectronics device packaging. This book is not just useful for those who attended the International Workshop on Nanopackaging in Grenoble, but can provide valuable information to scientists and technologists in the nanopackaging community.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

This book is a first attempt to merge two different communities: scientists and technologists. Therefore, it is not a general overview covering all the fields of nanopackaging, but is mainly focused on two topics. The first topic deals with atomic scale devices or circuit requirements, as well as related recent technological developments; for example, surface science engineering and atomic scale interconnects studies. The second main part of the book brings CNT nano-materials solutions for resolving interconnect or thermal management problems in microelectronics device packaging. This book is not just useful for those who attended the International Workshop on Nanopackaging in Grenoble, but can provide valuable information to scientists and technologists in the nanopackaging community.

More books from Springer International Publishing

Cover of the book Numerical PDE-Constrained Optimization by
Cover of the book Sensory Motor and Behavioral Research in Space by
Cover of the book The Automotive Transmission Book by
Cover of the book Surface Chemistry of Aqueous Corrosion Processes by
Cover of the book Introduction to Peak Oil by
Cover of the book Bipolar Depression: Molecular Neurobiology, Clinical Diagnosis, and Pharmacotherapy by
Cover of the book Perspectives of System Informatics by
Cover of the book Molecular Determinants of Head and Neck Cancer by
Cover of the book Dynamics in Geometrical Confinement by
Cover of the book Parabolic Equations in Biology by
Cover of the book Grand Challenge Problems in Technology-Enhanced Learning II: MOOCs and Beyond by
Cover of the book Dependability in Medicine and Neurology by
Cover of the book The Problem of Catalan by
Cover of the book Foundations of Programming Languages by
Cover of the book Probes of Multimessenger Astrophysics by
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy