Modeling Self-Heating Effects in Nanoscale Devices

Nonfiction, Science & Nature, Science, Other Sciences, Nanostructures, Physics, Electricity, General Physics
Cover of the book Modeling Self-Heating Effects in Nanoscale Devices by Katerina Raleva, Abdul Rawoof Sheik, Dragica Vasileska, Stephen M. Goodnick, Morgan & Claypool Publishers
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Author: Katerina Raleva, Abdul Rawoof Sheik, Dragica Vasileska, Stephen M. Goodnick ISBN: 9781681741871
Publisher: Morgan & Claypool Publishers Publication: September 13, 2017
Imprint: IOP Concise Physics Language: English
Author: Katerina Raleva, Abdul Rawoof Sheik, Dragica Vasileska, Stephen M. Goodnick
ISBN: 9781681741871
Publisher: Morgan & Claypool Publishers
Publication: September 13, 2017
Imprint: IOP Concise Physics
Language: English

It is generally acknowledged that modeling and simulation are preferred alternatives to trial and error approaches to semiconductor fabrication in the present environment, where the cost of process runs and associated mask sets is increasing exponentially with successive technology nodes. Hence, accurate physical device simulation tools are essential to accurately predict device and circuit performance.

Accurate thermal modelling and the design of microelectronic devices and thin film structures at the micro- and nanoscales poses a challenge to electrical engineers who are less familiar with the basic concepts and ideas in sub-continuum heat transport. This book aims to bridge that gap. Efficient heat removal methods are necessary to increase device performance and device reliability. The authors provide readers with a combination of nanoscale experimental techniques and accurate modelling methods that must be employed in order to determine a device's temperature profile.

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It is generally acknowledged that modeling and simulation are preferred alternatives to trial and error approaches to semiconductor fabrication in the present environment, where the cost of process runs and associated mask sets is increasing exponentially with successive technology nodes. Hence, accurate physical device simulation tools are essential to accurately predict device and circuit performance.

Accurate thermal modelling and the design of microelectronic devices and thin film structures at the micro- and nanoscales poses a challenge to electrical engineers who are less familiar with the basic concepts and ideas in sub-continuum heat transport. This book aims to bridge that gap. Efficient heat removal methods are necessary to increase device performance and device reliability. The authors provide readers with a combination of nanoscale experimental techniques and accurate modelling methods that must be employed in order to determine a device's temperature profile.

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