Lead-free Solders
Materials Reliability for Electronics
Nonfiction, Science & Nature, Technology, Material Science
| Author: | ISBN: | 9781119966807 | |
| Publisher: | Wiley | Publication: | March 6, 2012 |
| Imprint: | Wiley | Language: | English |
| Author: | |
| ISBN: | 9781119966807 |
| Publisher: | Wiley |
| Publication: | March 6, 2012 |
| Imprint: | Wiley |
| Language: | English |
Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers:
- Phase diagrams and alloy development
- Effect of minor alloying additions
- Composite approaches including nanoscale reinforcements
- Mechanical issues affecting reliability
- Reliability under impact loading
- Thermomechanical fatigue
- Chemical issues affecting reliability
- Whisker growth
- Electromigration
- Thermomigration
Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.
Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers:
- Phase diagrams and alloy development
- Effect of minor alloying additions
- Composite approaches including nanoscale reinforcements
- Mechanical issues affecting reliability
- Reliability under impact loading
- Thermomechanical fatigue
- Chemical issues affecting reliability
- Whisker growth
- Electromigration
- Thermomigration
Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.
