Author: | Kyung Suk (Dan) Oh, Xing Chao (Chuck) Yuan | ISBN: | 9780132827119 |
Publisher: | Pearson Education | Publication: | October 7, 2011 |
Imprint: | Prentice Hall | Language: | English |
Author: | Kyung Suk (Dan) Oh, Xing Chao (Chuck) Yuan |
ISBN: | 9780132827119 |
Publisher: | Pearson Education |
Publication: | October 7, 2011 |
Imprint: | Prentice Hall |
Language: | English |
New System-Level Techniques for Optimizing Signal/Power Integrity in High-Speed Interfaces--from Pioneering Innovators at Rambus, Stanford, Berkeley, and MIT
As data communication rates accelerate well into the multi-gigahertz range, ensuring signal integrity both on- and off-chip has become crucial. Signal integrity can no longer be addressed solely through improvements in package or board-level design: Diverse engineering teams must work together closely from the earliest design stages to identify the best system-level solutions. In High-Speed Signaling, several of the field’s most respected practitioners and researchers introduce cutting-edge modeling, simulation, and optimization techniques for meeting this challenge.
Edited by pioneering experts Drs. Dan Oh and Chuck Yuan, these contributors explain why noise and jitter are no longer separable, demonstrate how to model their increasingly complex interactions, and thoroughly introduce a new simulation methodology for predicting link-level performance with unprecedented accuracy.
The authors address signal integrity from architecture through high-volume production, thoroughly discussing design, implementation, and verification. Coverage includes
High-Speed Signaling thoroughly introduces new techniques pioneered at Rambus and other leading high-tech companies and universities: approaches that have never before been presented with this much practical detail. It will be invaluable to everyone concerned with signal integrity, including signal and power integrity engineers, high-speed I/O circuit designers, and system-level board design engineers.
New System-Level Techniques for Optimizing Signal/Power Integrity in High-Speed Interfaces--from Pioneering Innovators at Rambus, Stanford, Berkeley, and MIT
As data communication rates accelerate well into the multi-gigahertz range, ensuring signal integrity both on- and off-chip has become crucial. Signal integrity can no longer be addressed solely through improvements in package or board-level design: Diverse engineering teams must work together closely from the earliest design stages to identify the best system-level solutions. In High-Speed Signaling, several of the field’s most respected practitioners and researchers introduce cutting-edge modeling, simulation, and optimization techniques for meeting this challenge.
Edited by pioneering experts Drs. Dan Oh and Chuck Yuan, these contributors explain why noise and jitter are no longer separable, demonstrate how to model their increasingly complex interactions, and thoroughly introduce a new simulation methodology for predicting link-level performance with unprecedented accuracy.
The authors address signal integrity from architecture through high-volume production, thoroughly discussing design, implementation, and verification. Coverage includes
High-Speed Signaling thoroughly introduces new techniques pioneered at Rambus and other leading high-tech companies and universities: approaches that have never before been presented with this much practical detail. It will be invaluable to everyone concerned with signal integrity, including signal and power integrity engineers, high-speed I/O circuit designers, and system-level board design engineers.