Author: | ISBN: | 9780815519881 | |
Publisher: | Elsevier Science | Publication: | December 8, 2009 |
Imprint: | William Andrew | Language: | English |
Author: | |
ISBN: | 9780815519881 |
Publisher: | Elsevier Science |
Publication: | December 8, 2009 |
Imprint: | William Andrew |
Language: | English |
A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications.
Key topics covered include:
Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities.
• Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques
• Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs
• Discusses properties, preparation, and growth of silicon crystals and wafers
• Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures
A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications.
Key topics covered include:
Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities.
• Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques
• Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs
• Discusses properties, preparation, and growth of silicon crystals and wafers
• Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures