Fan-Out Wafer-Level Packaging

Nonfiction, Science & Nature, Technology, Nanotechnology, Electronics, Circuits
Cover of the book Fan-Out Wafer-Level Packaging by John H. Lau, Springer Singapore
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: John H. Lau ISBN: 9789811088841
Publisher: Springer Singapore Publication: April 5, 2018
Imprint: Springer Language: English
Author: John H. Lau
ISBN: 9789811088841
Publisher: Springer Singapore
Publication: April 5, 2018
Imprint: Springer
Language: English

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. 

Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. 

Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.

More books from Springer Singapore

Cover of the book Trusted Computing and Information Security by John H. Lau
Cover of the book AI Applications in Sheet Metal Forming by John H. Lau
Cover of the book High-Rise Buildings under Multi-Hazard Environment by John H. Lau
Cover of the book Designing Embedded Systems with Arduino by John H. Lau
Cover of the book Modern Chinese Literature, Lin Shu and the Reformist Movement by John H. Lau
Cover of the book Seamless Learning by John H. Lau
Cover of the book International Conference on Mathematical Sciences and Statistics 2013 by John H. Lau
Cover of the book The Story of Indian Manufacturing by John H. Lau
Cover of the book ICCCE 2018 by John H. Lau
Cover of the book Optical Soliton Communication Using Ultra-Short Pulses by John H. Lau
Cover of the book Minerals and Allied Natural Resources and their Sustainable Development by John H. Lau
Cover of the book The Globalization Conundrum—Dark Clouds behind the Silver Lining by John H. Lau
Cover of the book Protein Reviews by John H. Lau
Cover of the book Five Basic Institution Structures and Institutional Economics by John H. Lau
Cover of the book Citizen’s Right to the Digital City by John H. Lau
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy