Encapsulation Technologies for Electronic Applications

Nonfiction, Science & Nature, Technology, Technical & Manufacturing Industries & Trades, Electronics
Cover of the book Encapsulation Technologies for Electronic Applications by Haleh Ardebili, Michael Pecht, Elsevier Science
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Haleh Ardebili, Michael Pecht ISBN: 9780815519706
Publisher: Elsevier Science Publication: July 22, 2009
Imprint: William Andrew Language: English
Author: Haleh Ardebili, Michael Pecht
ISBN: 9780815519706
Publisher: Elsevier Science
Publication: July 22, 2009
Imprint: William Andrew
Language: English

Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations.

Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-shelf (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability.

With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packaging (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechanical systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs).

This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology.

  • Guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics
  • Coverage of environmentally friendly 'green encapsulants'
  • Practical coverage of faults and defects: how to analyze them and how to avoid them
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations.

Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-shelf (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability.

With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packaging (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechanical systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs).

This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology.

More books from Elsevier Science

Cover of the book A Historical Introduction to Mathematical Modeling of Infectious Diseases by Haleh Ardebili, Michael Pecht
Cover of the book Solid-Liquid Filtration by Haleh Ardebili, Michael Pecht
Cover of the book Metal Nanoparticles and Nanoalloys by Haleh Ardebili, Michael Pecht
Cover of the book Advances in Protein Chemistry and Structural Biology by Haleh Ardebili, Michael Pecht
Cover of the book Muscular Dystrophies by Haleh Ardebili, Michael Pecht
Cover of the book Starting Electronics by Haleh Ardebili, Michael Pecht
Cover of the book Python Passive Network Mapping by Haleh Ardebili, Michael Pecht
Cover of the book Renewable Energy System Design by Haleh Ardebili, Michael Pecht
Cover of the book Lasers for Medical Applications by Haleh Ardebili, Michael Pecht
Cover of the book Advances in Quantum Chemistry by Haleh Ardebili, Michael Pecht
Cover of the book Non-Thermal Plasma Technology for Polymeric Materials by Haleh Ardebili, Michael Pecht
Cover of the book Ion Transport in Prokaryotes by Haleh Ardebili, Michael Pecht
Cover of the book Theoretical Mechanics of Biological Neural Networks by Haleh Ardebili, Michael Pecht
Cover of the book Side Effects of Drugs Annual by Haleh Ardebili, Michael Pecht
Cover of the book Lead Compounds from Medicinal Plants for the Treatment of Neurodegenerative Diseases by Haleh Ardebili, Michael Pecht
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy