Electromigration Modeling at Circuit Layout Level

Nonfiction, Science & Nature, Technology, Quality Control, Electronics, Circuits
Cover of the book Electromigration Modeling at Circuit Layout Level by Feifei He, Cher Ming Tan, Springer Singapore
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Feifei He, Cher Ming Tan ISBN: 9789814451215
Publisher: Springer Singapore Publication: March 16, 2013
Imprint: Springer Language: English
Author: Feifei He, Cher Ming Tan
ISBN: 9789814451215
Publisher: Springer Singapore
Publication: March 16, 2013
Imprint: Springer
Language: English

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.

More books from Springer Singapore

Cover of the book Risk Based Technologies by Feifei He, Cher Ming Tan
Cover of the book Novel Motion Anchoring Strategies for Wavelet-based Highly Scalable Video Compression by Feifei He, Cher Ming Tan
Cover of the book Field Emission Scanning Electron Microscopy by Feifei He, Cher Ming Tan
Cover of the book Essays in Economic Dynamics by Feifei He, Cher Ming Tan
Cover of the book Pains and Gains of Ethnic Multilingual Learners in China by Feifei He, Cher Ming Tan
Cover of the book Research into Design for Communities, Volume 2 by Feifei He, Cher Ming Tan
Cover of the book Social Life Cycle Assessment by Feifei He, Cher Ming Tan
Cover of the book Fabrication of Metal–Organic Framework Derived Nanomaterials and Their Electrochemical Applications by Feifei He, Cher Ming Tan
Cover of the book Metabolic Engineering for Bioactive Compounds by Feifei He, Cher Ming Tan
Cover of the book Proceedings of the Second International Conference on Computational Intelligence and Informatics by Feifei He, Cher Ming Tan
Cover of the book Education Policy and Reform in China by Feifei He, Cher Ming Tan
Cover of the book Principal Component Analysis Networks and Algorithms by Feifei He, Cher Ming Tan
Cover of the book Consumer Behaviour and Sustainable Fashion Consumption by Feifei He, Cher Ming Tan
Cover of the book Inclusion, Equity and Access for Individuals with Disabilities by Feifei He, Cher Ming Tan
Cover of the book Global Change and Human Mobility by Feifei He, Cher Ming Tan
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy