Electrical Design of Through Silicon Via

Nonfiction, Computers, Advanced Computing, Programming, Expert Systems, Science & Nature, Technology, Electronics, Circuits
Cover of the book Electrical Design of Through Silicon Via by , Springer Netherlands
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Author: ISBN: 9789401790383
Publisher: Springer Netherlands Publication: May 11, 2014
Imprint: Springer Language: English
Author:
ISBN: 9789401790383
Publisher: Springer Netherlands
Publication: May 11, 2014
Imprint: Springer
Language: English

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.

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