Electrical Design of Through Silicon Via

Nonfiction, Computers, Advanced Computing, Programming, Expert Systems, Science & Nature, Technology, Electronics, Circuits
Cover of the book Electrical Design of Through Silicon Via by , Springer Netherlands
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: ISBN: 9789401790383
Publisher: Springer Netherlands Publication: May 11, 2014
Imprint: Springer Language: English
Author:
ISBN: 9789401790383
Publisher: Springer Netherlands
Publication: May 11, 2014
Imprint: Springer
Language: English

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.

More books from Springer Netherlands

Cover of the book Japanese Phrase Structure Grammar by
Cover of the book Nano Devices and Circuit Techniques for Low-Energy Applications and Energy Harvesting by
Cover of the book Literature and Society by
Cover of the book The Epidemiology of Aging by
Cover of the book Ultrasonography in Ophthalmology XV by
Cover of the book Xth I.S.C.E.R.G. Symposium by
Cover of the book Brain Dopaminergic Systems: Imaging with Positron Tomography by
Cover of the book Managing Environmental Disputes by
Cover of the book Stem Cells and Cancer Stem Cells, Volume 10 by
Cover of the book Butterfly Conservation in North America by
Cover of the book Hart's Legal Philosophy by
Cover of the book Grain Boundaries by
Cover of the book Metabolic Processes in the Foetus and Newborn Infant by
Cover of the book Ageing in Advanced Industrial States by
Cover of the book The German Perfect by
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy