Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Nonfiction, Science & Nature, Technology, Electronics, Circuits, Computers, Advanced Computing, Engineering, Computer Architecture
| Author: | Brandon Noia, Krishnendu Chakrabarty | ISBN: | 9783319023786 |
| Publisher: | Springer International Publishing | Publication: | November 19, 2013 |
| Imprint: | Springer | Language: | English |
| Author: | Brandon Noia, Krishnendu Chakrabarty |
| ISBN: | 9783319023786 |
| Publisher: | Springer International Publishing |
| Publication: | November 19, 2013 |
| Imprint: | Springer |
| Language: | English |
This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.
This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.
