CMOS Past, Present and Future

Nonfiction, Science & Nature, Technology, Electronics, Semiconductors, Material Science
Cover of the book CMOS Past, Present and Future by Henry Radamson, Eddy Simoen, Jun Luo, Chao Zhao, Elsevier Science
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Author: Henry Radamson, Eddy Simoen, Jun Luo, Chao Zhao ISBN: 9780081021408
Publisher: Elsevier Science Publication: April 3, 2018
Imprint: Woodhead Publishing Language: English
Author: Henry Radamson, Eddy Simoen, Jun Luo, Chao Zhao
ISBN: 9780081021408
Publisher: Elsevier Science
Publication: April 3, 2018
Imprint: Woodhead Publishing
Language: English

CMOS Past, Present and Future provides insight from the basics, to the state-of-the-art of CMOS processing and electrical characterization, including the integration of Group IV semiconductors-based photonics. The book goes into the pitfalls and opportunities associated with the use of hetero-epitaxy on silicon with strain engineering and the integration of photonics and high-mobility channels on a silicon platform. It begins with the basic definitions and equations, but extends to present technologies and challenges, creating a roadmap on the origins of the technology and its evolution to the present, along with a vision for future trends.

The book examines the challenges and opportunities that materials beyond silicon provide, including a close look at high-k materials and metal gate, strain engineering, channel material and mobility, and contacts. The book's key approach is on characterizations, device processing and electrical measurements.

  • Addresses challenges and opportunities for the use of CMOS
  • Covers the latest methods of strain engineering, materials integration to increase mobility, nano-scaled transistor processing, and integration of CMOS with photonic components
  • Provides a look at the evolution of CMOS technology, including the origins of the technology, current status and future possibilities
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

CMOS Past, Present and Future provides insight from the basics, to the state-of-the-art of CMOS processing and electrical characterization, including the integration of Group IV semiconductors-based photonics. The book goes into the pitfalls and opportunities associated with the use of hetero-epitaxy on silicon with strain engineering and the integration of photonics and high-mobility channels on a silicon platform. It begins with the basic definitions and equations, but extends to present technologies and challenges, creating a roadmap on the origins of the technology and its evolution to the present, along with a vision for future trends.

The book examines the challenges and opportunities that materials beyond silicon provide, including a close look at high-k materials and metal gate, strain engineering, channel material and mobility, and contacts. The book's key approach is on characterizations, device processing and electrical measurements.

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