Carbon Nanotubes for Interconnects

Process, Design and Applications

Nonfiction, Science & Nature, Technology, Electronics, Circuits, Computers, Advanced Computing, Engineering, Computer Architecture
Cover of the book Carbon Nanotubes for Interconnects by , Springer International Publishing
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: ISBN: 9783319297460
Publisher: Springer International Publishing Publication: July 9, 2016
Imprint: Springer Language: English
Author:
ISBN: 9783319297460
Publisher: Springer International Publishing
Publication: July 9, 2016
Imprint: Springer
Language: English

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

More books from Springer International Publishing

Cover of the book The Euro by
Cover of the book Oncological PET/CT with Histological Confirmation by
Cover of the book Information Theory and Coding - Solved Problems by
Cover of the book The Female Philosopher and Her Afterlives by
Cover of the book A Course in Classical Physics 3 — Electromagnetism by
Cover of the book Trustworthy Global Computing by
Cover of the book Food Law and Regulation for Non-Lawyers by
Cover of the book Bioactive Compounds from Marine Extremophiles by
Cover of the book Information Security Practices by
Cover of the book Recent Research in Control Engineering and Decision Making by
Cover of the book Big Data Analytics in Genomics by
Cover of the book Ubiquitous Communications and Network Computing by
Cover of the book Dynamic Systems for Everyone by
Cover of the book Beastly Blake by
Cover of the book From Cave Man to Cave Martian by
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy