Yu Ting Cheng: 1 book

Book cover of MEMS Packaging
by Y C Lee, Yu-Ting Cheng, Ramesh Ramadoss
Language: English
Release Date: January 3, 2018

MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing...
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