From 1D to 4D for 90–22 nm Technology Nodes
by
Artur Balasinski
Language: English
Release Date: October 5, 2013
This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes. It is a valuable guide for layout designers, packaging engineers...