Electronics category: 3783 books

Cover of Advances in Imaging and Electron Physics
by Peter W. Hawkes
Language: English
Release Date: February 2, 2010

Advances in Imaging and Electron Physics merges two long-running serials--Advances in Electronics and Electron Physics and Advances in Optical and Electron Microscopy. This series features extended articles on the physics of electron devices (especially semiconductor devices), particle optics...
Cover of Neurally Based Measurement and Evaluation of Environmental Noise
by Yoshiharu Soeta, Yoichi Ando
Language: English
Release Date: May 4, 2015

This book deals with methods of measurement and evaluation of environmental noise based on an auditory neural and brain-oriented model. The model consists of the autocorrelation function (ACF) and the interaural cross-correlation function (IACF) mechanisms for signals arriving at the two ear entrances....
Cover of Computational Electromagnetics—Retrospective and Outlook
by
Language: English
Release Date: August 27, 2014

The book will cover the past, present and future developments of field theory and computational electromagnetics. The first two chapters will give an overview of the historical developments and the present the state-of-the-art in computational electromagnetics. These two chapters will set the stage...
Cover of Passive Components for Circuit Design
by Ian Sinclair
Language: English
Release Date: November 20, 2000

Passive Components for Circuit Design is a unique introduction to this key area of analog electronics designed for technician engineers and anyone involved in circuit design. The coverage encompasses all component types capable of power amplification: resistors, capacitors, transformers, solenoids,...
Cover of Fundamental & Applied Problems of Terahertz Devices and Technologies

Fundamental & Applied Problems of Terahertz Devices and Technologies

Selected Papers from the RussiaJapanUSA Symposium (RJUS TeraTech-2014)

by Michael Shur
Language: English
Release Date: August 13, 2015

This book brings together seven selected best papers presented at the 2014 Russia–Japan–USA Symposium on Fundamental and Applied Problems of Terahertz Devices and Technologies (RJUS TeraTech-2014), which was held at the University of Buffalo, New York, USA on 17–21 June 2014. As the third...
Cover of High-Resolution Microwave Imaging
by Ruliang Yang, Haiying Li, Shiqiang Li
Language: English
Release Date: December 13, 2017

This book comprehensively describes high-resolution microwave imaging and super-resolution information processing technologies and discusses new theories, methods and achievements in the high-resolution microwave imaging fields. Its chapters, which include abundant research results and examples, systematically...
Cover of Multi-Disciplinary Digital Signal Processing

Multi-Disciplinary Digital Signal Processing

A Functional Approach Using Matlab

by E. S. Gopi
Language: English
Release Date: August 10, 2017

This book provides a comprehensive overview of digital signal processing for a multi-disciplinary audience. It posits that though the theory involved in digital signal processing stems from electrical, electronics, communication, and control engineering, the topic has use in other disciplinary areas...
Cover of Advances in Imaging and Electron Physics
by Peter W. Hawkes
Language: English
Release Date: June 15, 2018

Advances in Imaging and Electron Physics, Volume 206, merges two long-running serials, Advances in Electronics and Electron Physics and Advances in Optical and Electron Microscopy. The series features extended articles on the physics of electron devices (especially semiconductor devices), particle...
Cover of The 15 Most Popular Gift Ideas for Christmas 2013: Gadgets
by Gianfranco Rota
Language: English
Release Date: November 5, 2013

This top-15 list compiles the newest, trending, buzzing, best of the best in WORLDWIDE gadgets so that you don't have to waste so much time scouring the internet, rely on your local electronics store's selection, or even look for the stores that actually sell the gift(s) you're interested...
Cover of Binary Numbers

Binary Numbers

* A Step-by-Step Guide to Binary Numbers Electronic

by Su TP
Language: English
Release Date: June 12, 2018

Want to learn even more about Binary Numbers ? * A Step-by-Step Guide to Binary Numbers Electronics # Introducing Binary Numbers Table of contents: Binary Numbers Binary to Decimal Conversion Hexadecimal Numbers Octal Number System Binary...
Cover of Advanced Materials for Integrated Optical Waveguides
by Xingcun Colin Tong Ph.D
Language: English
Release Date: October 17, 2013

This book provides a comprehensive introduction to integrated optical waveguides for information technology and data communications. Integrated coverage ranges from advanced materials, fabrication, and characterization techniques to guidelines for design and simulation. A concluding chapter offers...
Cover of Organic Light-Emitting Transistors

Organic Light-Emitting Transistors

Towards the Next Generation Display Technology

by Michele Muccini, Stefano Toffanin
Language: English
Release Date: March 29, 2016

Provides an overview of the developments and applications of Organic Light Emitting Transistors (OLETs) science and technology This book discusses the scientific fundamentals and key technological features of Organic Light Emitting Transistors (OLETs) by putting them in the context of organic...
Cover of Printed Films

Printed Films

Materials Science and Applications in Sensors, Electronics and Photonics

by
Language: English
Release Date: August 30, 2012

Whilst printed films are currently used in varied devices across a wide range of fields, research into their development and properties is increasingly uncovering even greater potential. Printed films provides comprehensive coverage of the most significant recent developments in printed films and...
Cover of Design and Modeling for 3D ICs and Interposers
by Madhavan Swaminathan, Ki Jin Han
Language: English
Release Date: November 5, 2013

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology,...
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