Alloys and Composites of Polybenzoxazines

Properties and Applications

Nonfiction, Science & Nature, Technology, Textiles & Polymers, Material Science, Science
Cover of the book Alloys and Composites of Polybenzoxazines by Sarawut Rimdusit, Sunan Tiptipakorn, Chanchira Jubsilp, Springer Singapore
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Sarawut Rimdusit, Sunan Tiptipakorn, Chanchira Jubsilp ISBN: 9789814451765
Publisher: Springer Singapore Publication: July 16, 2013
Imprint: Springer Language: English
Author: Sarawut Rimdusit, Sunan Tiptipakorn, Chanchira Jubsilp
ISBN: 9789814451765
Publisher: Springer Singapore
Publication: July 16, 2013
Imprint: Springer
Language: English

This book provides an introduction to the unique and fascinating properties of alloys and composites from novel commercialized thermosetting resins based on polybenzoxazines. Their outstanding properties such as processability, thermal, mechanical, electrical properties as well as ballistic impact properties of polybenzoxazine alloys and composites make them attractive for various applications in electronic packaging encapsulation, light weight ballistic armour composites and bipolar plate in fuel cells.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

This book provides an introduction to the unique and fascinating properties of alloys and composites from novel commercialized thermosetting resins based on polybenzoxazines. Their outstanding properties such as processability, thermal, mechanical, electrical properties as well as ballistic impact properties of polybenzoxazine alloys and composites make them attractive for various applications in electronic packaging encapsulation, light weight ballistic armour composites and bipolar plate in fuel cells.

More books from Springer Singapore

Cover of the book Rice Productivity and Food Security in India by Sarawut Rimdusit, Sunan Tiptipakorn, Chanchira Jubsilp
Cover of the book Proceedings of the International Conference on Microelectronics, Computing & Communication Systems by Sarawut Rimdusit, Sunan Tiptipakorn, Chanchira Jubsilp
Cover of the book Ecological Wisdom by Sarawut Rimdusit, Sunan Tiptipakorn, Chanchira Jubsilp
Cover of the book Proceedings of International Conference on Wireless Communication by Sarawut Rimdusit, Sunan Tiptipakorn, Chanchira Jubsilp
Cover of the book Advances in Principal Component Analysis by Sarawut Rimdusit, Sunan Tiptipakorn, Chanchira Jubsilp
Cover of the book A Forward Looking Approach to Project Management by Sarawut Rimdusit, Sunan Tiptipakorn, Chanchira Jubsilp
Cover of the book User Interface Design of Digital Textbooks by Sarawut Rimdusit, Sunan Tiptipakorn, Chanchira Jubsilp
Cover of the book Innovative Diagnostics and Treatment: Nanorobotics and Stem Cells by Sarawut Rimdusit, Sunan Tiptipakorn, Chanchira Jubsilp
Cover of the book Advances in Big Data and Cloud Computing by Sarawut Rimdusit, Sunan Tiptipakorn, Chanchira Jubsilp
Cover of the book Development and Quantification of Sustainability Indicators by Sarawut Rimdusit, Sunan Tiptipakorn, Chanchira Jubsilp
Cover of the book Third Harmonic Utilization in Permanent Magnet Machines by Sarawut Rimdusit, Sunan Tiptipakorn, Chanchira Jubsilp
Cover of the book Coopetition for Regional Competitiveness by Sarawut Rimdusit, Sunan Tiptipakorn, Chanchira Jubsilp
Cover of the book Design and Control of Matrix Converters by Sarawut Rimdusit, Sunan Tiptipakorn, Chanchira Jubsilp
Cover of the book The Catholic Church in Taiwan by Sarawut Rimdusit, Sunan Tiptipakorn, Chanchira Jubsilp
Cover of the book Blended Learning Designs in STEM Higher Education by Sarawut Rimdusit, Sunan Tiptipakorn, Chanchira Jubsilp
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy